Quiz

Question 1 of 10

Why does increasing leading-edge wafer output fail to raise accelerator supply when advanced packaging is the binding constraint?

• ABecause wafers are cheaper than packaging and buyers refuse to pay
• BBecause bare logic dies cannot become shippable products until they pass through the saturated packaging line that integrates them with memory and substrate
• CBecause leading-edge wafers are always in surplus
• DBecause packaging destroys most of the dies during assembly