Catalog · Chips & Density

Advanced Packaging & Substrate Capacity

What’s inside

1. Module 1

   The Second Bottleneck: Why Wafers Were Never the Whole Story

   • What a Modern Accelerator Actually Is · 3 min · narrated
   • The Inversion: When Packaging Became the Ceiling · 3 min · narrated
   • Module review

2. Module 2

   The Integration Toolbox: CoWoS, SoIC, and Foveros

   • Side by Side: The Interposer Approach · 3 min · narrated
   • Stacking Up: Fused and Tiled Vertical Integration · 4 min · narrated
   • Module review

3. Module 3

   Who Holds the Gate: TSMC Packaging and the Substrate Layer

   • The Foundry's Packaging Line · 4 min · narrated
   • The Substrate Floor: Ibiden, Shinko, and the Materials Layer · 4 min · narrated
   • Module review

4. Module 4

   Downstream Consequences: How a GPU Generation Bends the Whole Chain

   • The Propagation: From Design Decision to Finished-Unit Supply · 4 min · narrated
   • Allocation, Queues, and Reading the Market · 4 min · narrated
   • Module review